Invention Application
- Patent Title: INTEGRATED CIRCUIT COMPRISING A CAPACITIVE ELEMENT, AND MANUFACTURING METHOD
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Application No.: US16400286Application Date: 2019-05-01
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Publication No.: US20190341446A1Publication Date: 2019-11-07
- Inventor: Abderrezak MARZAKI
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Priority: FR1853778 20180502
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L27/11517 ; H01L29/06

Abstract:
A capacitive element of an integrated circuit includes first and second electrodes. The first electrode is formed by a first electrically conductive layer located above a semiconductor well doped with a first conductivity type. The second electrode is formed by a second electrically conductive layer located above the first electrically conductive layer of the semiconductor well. The second electrode is further formed by a doped surface region within the semiconductor well that is heavily doped with a second conductivity type opposite the first conductivity type, wherein the doped surface region is located under the first electrically conductive layer. An inter-electrode dielectric area electrically separates the first electrode and the second electrode.
Public/Granted literature
- US10943973B2 Integrated circuit comprising low voltage capacitive elements Public/Granted day:2021-03-09
Information query
IPC分类: