Invention Application
- Patent Title: Liquid Discharge Head, Liquid Discharge Apparatus, And Wiring Substrate
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Application No.: US16442831Application Date: 2019-06-17
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Publication No.: US20190381796A1Publication Date: 2019-12-19
- Inventor: Eiju HIRAI , Daisuke YAMADA , Shingo TOMIMATSU
- Applicant: Seiko Epson Corporation
- Priority: JP2018-115272 20180618
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
There is provided a liquid discharge head including a first wiring through which a drive signal is input to a wiring substrate, in which the wiring substrate has a substrate having a first surface and a second surface that opposes the first surface, a second wiring formed on the first surface, a third wiring formed on the second surface, a fourth wiring and a fifth wiring that pass through the substrate and electrically couples the second wiring with the third wiring, and an electrode provided on the second wiring and electrically couples the second wiring with the first wiring, and the electrode is positioned between a first coupling point at which the fourth wiring is electrically coupled to the second wiring and a second coupling point at which the fifth wiring is electrically coupled to the second wiring, in the second wiring.
Public/Granted literature
Information query
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