A package includes a first lead, a first molded body, a second lead, and a second molded body. The first lead includes a first portion which has a first recess portion or a first through hole passing through the first portion. The second lead is provided on the first lead to be bonded to the first lead such that a bonding side surface faces to the first lead. The second lead includes a second portion which overlaps with the first portion and which has a second recess portion on the bonding side surface or a second through hole passing through the second portion. The second recess portion communicates with the first through hole. The second through hole communicates with the first recess portion. The second molded body fills the first through hole and the second recess portion, or fills the first recess portion and the second through hole.