发明申请
- 专利标题： ACOUSTIC RESONATOR PACKAGE
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申请号： US16271158申请日： 2019-02-08
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公开(公告)号： US20200021265A1公开(公告)日： 2020-01-16
- 发明人: Tae Kyung LEE , Kwang Su KIM , Jin Suk SON , Yeong Gyu LEE , Sung Sun KIM , Sang Jin KIM
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2018-0081768 20180713
- 主分类号： H03H9/02
- IPC分类号： H03H9/02 ; H03H9/15 ; H03H9/54
摘要：
An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other, wherein the cap includes a trench formed around the bonding portion and a protective layer covering a surface of the trench in the cap, and wherein a portion of the bonding portion fills at least a portion of the trench.
公开/授权文献
- US10715098B2 Acoustic resonator package 公开/授权日：2020-07-14
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