Invention Application
- Patent Title: QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME
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Application No.: US16337179Application Date: 2017-09-27
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Publication No.: US20200032011A1Publication Date: 2020-01-30
- Inventor: Hong Gu HWANG , Jung Seok HAHN , Haeshin LEE , Younseon WANG
- Applicant: KOLON INDUSTRIES, INC. , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul KR Yuseong-gu, Daejeon
- Assignee: KOLON INDUSTRIES, INC.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOLON INDUSTRIES, INC.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul KR Yuseong-gu, Daejeon
- Priority: KR10-2016-0124795 20160928; KR10-2017-0123517 20170925
- International Application: PCT/KR2017/010695 WO 20170927
- Main IPC: C08J5/08
- IPC: C08J5/08 ; C08K7/22 ; C08L79/02 ; C09D179/02 ; C09J179/02

Abstract:
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.
Public/Granted literature
- US11001683B2 Quinone curable compositions and adhesive compositions comprising same Public/Granted day:2021-05-11
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