Invention Application
- Patent Title: SEMICONDUCTOR MEMORY MODULE INCLUDING NONVOLATILE MEMORY DEVICES
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Application No.: US16390077Application Date: 2019-04-22
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Publication No.: US20200042232A1Publication Date: 2020-02-06
- Inventor: TAESUNG LEE , JUNGHWAN CHOI
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2018-0090797 20180803
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F12/02 ; G06F12/0866

Abstract:
A semiconductor memory module includes data buffers that exchange first data signals with an external device, nonvolatile memory devices that are respectively connected to the data buffers through data lines, and a controller connected to the data lines. The controller receives an address, a command, and a control signal from the external device, and depending on the address, the command, and the control signal, the controller controls the data buffers through first control lines and controls the nonvolatile memory devices through second control lines.
Public/Granted literature
- US10908840B2 Semiconductor memory module including nonvolatile memory devices Public/Granted day:2021-02-02
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