- 专利标题: ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL
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申请号: US16396025申请日: 2019-04-26
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公开(公告)号: US20200091193A1公开(公告)日: 2020-03-19
- 发明人: Xingfeng REN , Mingjing LI , Mingjian YU
- 申请人: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- 优先权: CN201811093705.7 20180919
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L27/32
摘要:
An array substrate, a manufacturing method thereof and a display panel are provided, the array substrate includes a base substrate and a first conductive layer, a first insulating layer, a second conductive layer and a third conductive layer which are sequentially stacked on the base substrate, the first insulating layer insulates the first conductive layer from the second conductive layer, the first conductive layer includes a first signal line, the second conductive layer includes a second signal line and a first connection part spaced apart from each other, the third conductive layer includes a second connection part, the first connection part is electrically connected with the first signal line through a first via hole in the first insulating layer; the second connection part is electrically connected with the first connection part and the second signal line to constitute a connection structure electrically connecting the first signal line with the second signal line.
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