A mobile terminal including a metal frame; a circuit board including at least one processor chip; a shield member mounted on the circuit board and shielding the at least one processor chip; and a heat pipe including a heat plate part contacting the shield member and a heat transfer unit transferring heat generated by the least one processor. Further, the heat plate part and the heat transfer unit are integrally engaged via a soldering part positioned in an overlapped area between the heat plate part and the heat transfer unit.