Invention Application
- Patent Title: ADAPTATIVE CURING
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Application No.: US16146158Application Date: 2018-09-28
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Publication No.: US20200101765A1Publication Date: 2020-04-02
- Inventor: Pablo Vidal Alvarez , Daniel Gutierrez Garcia , Emilio Angulo Navarro , Vicente Serra Jorro
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J11/00
- IPC: B41J11/00 ; B41J3/407

Abstract:
Adaptative substrate curing by ejecting a curing flow rate to a curing zone by: heating a heating fluid to a curing temperature; causing the heating fluid to flow along a plurality of serially connected chambers separated being each pair of chambers separated by a heating fluid restrictor, actuating on the heating fluid restrictor as to determine a restricted flow rate between adjacent chambers thereby defining a curing flow rate that passes from the chambers towards the curing zone.
Public/Granted literature
- US10688810B2 Adaptative curing Public/Granted day:2020-06-23
Information query
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