Invention Application

ADAPTATIVE CURING
Abstract:
Adaptative substrate curing by ejecting a curing flow rate to a curing zone by: heating a heating fluid to a curing temperature; causing the heating fluid to flow along a plurality of serially connected chambers separated being each pair of chambers separated by a heating fluid restrictor, actuating on the heating fluid restrictor as to determine a restricted flow rate between adjacent chambers thereby defining a curing flow rate that passes from the chambers towards the curing zone.
Public/Granted literature
Information query
Patent Agency Ranking
0/0