Invention Application
- Patent Title: LOW DIELECTRIC CONSTANT (DK) AND DISSIPATION FACTOR (DF) MATERIAL FOR NANO-MOLDING TECHNOLOGY (NMT)
-
Application No.: US16627409Application Date: 2018-12-28
-
Publication No.: US20200140679A1Publication Date: 2020-05-07
- Inventor: Hui PENG , Bing GUAN , Wei SHAN
- Applicant: SABIC GLOBAL TECHNOLOGIES B.V.
- Applicant Address: NL Bergen op Zoom
- Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee Address: NL Bergen op Zoom
- International Application: PCT/IB2018/060704 WO 20181228
- Main IPC: C08L67/02
- IPC: C08L67/02 ; C08J5/04 ; B29C45/14 ; B29C45/00 ; H01Q1/36
Abstract:
The disclosure concerns thermoplastic resin compositions including a polymer resin, a dielectric glass fiber component, a hollow glass fiber, and an impact modifier.
Public/Granted literature
- US10752771B2 Low dielectric constant (DK) and dissipation factor (DF) material for nano-molding technology (NMT) Public/Granted day:2020-08-25
Information query
