Invention Application
- Patent Title: FORMING METHOD OF METAL LAYER
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Application No.: US16676444Application Date: 2019-11-07
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Publication No.: US20200147683A1Publication Date: 2020-05-14
- Inventor: Yi-Tsung Pan , Jer-Young Chen , Chuan-Sheng Chuang , Shinn-Jen Chang , Chi-San Chen , Li-Shing Chou
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F3/105

Abstract:
Provided is a forming method of a metal layer suitable for a 3D printing process. The method includes the steps of providing a plurality of metal particles on a substrate; applying an oxide-removing agent to the metal particles to remove metal oxides on the metal particles; at a first temperature, performing a first heat treatment on the metal particles for which the metal oxides are removed to form a near shape; and at a second temperature, performing a second heat treatment on the near shape to form a sintered body. The first temperature is lower than the second temperature.
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