An assembly for lapping multiple row bars, the assembly including a carrier having at least one carrier bond pad, multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad, an electrical connection between at least one of the carrier bond pads and at least one of the row bar bond pads of the first row bar, and at least one electrical trace extending through at least two of the multiple row bars and electrically connected to at least the first row bar and one additional row bar of the stack. An outermost row bar of the stack includes an outer surface and at least one electronic lapping guide.