Invention Application
- Patent Title: METHOD FOR FORMING COVER FILM
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Application No.: US16718579Application Date: 2019-12-18
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Publication No.: US20200148845A1Publication Date: 2020-05-14
- Inventor: Hitoshi OSAKI
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08F297/02 ; H01L21/02

Abstract:
A method for forming a cover film includes applying a composition including a first polymer and a solvent on a surface of a base material to form a coating film. The base material includes a surface layer which includes a first region and a second region having a surface condition that differs from a surface condition of the first region. The coating film is heated. A portion of the coating film is desorbed with a rinse agent after the heating. The portion is formed on the second region of the coating film. The first polymer includes a first structural unit represented by formula (1), or includes a monovalent organic group which bonds to at least one end of a main chain of the first polymer and which includes a nitrogen atom.
Information query