Invention Application
- Patent Title: Device and Method for Increasing the Heat Yield of a Heat Source
-
Application No.: US16611090Application Date: 2018-04-30
-
Publication No.: US20200149788A1Publication Date: 2020-05-14
- Inventor: Jochen Schäfer , Florian Reissner
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46cb5b3
- International Application: PCT/EP2018/061001 WO 20180430
- Main IPC: F25B27/02
- IPC: F25B27/02 ; F25B29/00 ; F25B30/06 ; F25B49/02

Abstract:
Various embodiments include a device for increasing the heat yield of a heat source comprising: a heat sink; a heat pump with a condenser and an evaporator; and a heat sink feed and a heat sink return providing a thermal coupling to the heat source with a heat exchanger. The condenser is thermally coupled to the heat sink feed for emitting heat to the heat sink. The evaporator is thermally coupled to the heat sink return for absorbing heat.
Information query