Invention Application
- Patent Title: POWER ELECTRONICS MODULES INCLUDING INTEGRATED COOLING
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Application No.: US16189502Application Date: 2018-11-13
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Publication No.: US20200152548A1Publication Date: 2020-05-14
- Inventor: Shailesh N. Joshi , Naoya Take , Ercan Mehmet Dede , Yanghe Liu
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US TX Plano
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US TX Plano
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H05K7/20

Abstract:
A power electronics module includes a power electronics device, and an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining a plurality of channels extending through the electrically-conductive substrate, and a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels.
Public/Granted literature
Information query
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