Invention Application
- Patent Title: METHOD AND SYSTEM FOR CONTROLLING POLISHING AND GRINDING
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Application No.: US16233859Application Date: 2018-12-27
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Publication No.: US20200156211A1Publication Date: 2020-05-21
- Inventor: Cheng-Peng Kuan , Chih-Hsuan Shih , Kuo-Feng Hung , Yen-Chung Chang , Hung-Hsiu Yu
- Applicant: Industrial Technology Research Institute
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@485b93e5
- Main IPC: B24B51/00
- IPC: B24B51/00 ; B25J11/00 ; B24B21/16 ; B24B49/00

Abstract:
A method for controlling polishing and grinding is provided, including: generating an initial polishing and grinding trajectory for robot movements based on a three-dimensional contour of a work piece; adjusting the initial polishing and grinding trajectory based on a first optimized adjustment value and generating an optimized polishing and grinding trajectory; and evaluating the polishing and grinding quality of the work piece and using the polishing and grinding quality to generate a second optimized adjustment value.
Information query