Invention Application
- Patent Title: HEAT PUMP CYCLE DEVICE AND VALVE DEVICE
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Application No.: US16774250Application Date: 2020-01-28
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Publication No.: US20200158382A1Publication Date: 2020-05-21
- Inventor: Daiki KATO , Masaaki KAWAKUBO , Tetsuya ITO , Yasuhiro KAWASE , Ryohei SUGIMURA , Hiroshi MIEDA
- Applicant: DENSO CORPORATION
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3a6e1805
- Main IPC: F25B9/14
- IPC: F25B9/14 ; F25B30/02 ; F25D31/00

Abstract:
In a heat pump cycle device, a flow passage switching portion includes a flow passage switching valve body configured to open and close a cooling side flow passage. A refrigerant circulation circuit includes a low-pressure flow passage through which a low-pressure refrigerant decompressed by a first decompressor flows toward a compressor in a heating mode, and a pre-evaporator flow passage provided between the flow passage switching valve body and a refrigerant inlet of an evaporator. The flow passage switching portion causes a pre-evaporator flow passage to communicate with the low-pressure flow passage while bypassing the evaporator when a refrigerant pressure in the low-pressure flow passage is lower than a refrigerant pressure in the pre-evaporator flow passage, in the heating mode.
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