Invention Application
- Patent Title: ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
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Application No.: US16456757Application Date: 2019-06-28
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Publication No.: US20200161157A1Publication Date: 2020-05-21
- Inventor: Yongwoo LEE , Youngjin NOH , Myungsun CHOI , Minyoung HUR , Seungbo SHIM , Jaehak LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2bbd529c
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/3065 ; H01J37/32
Abstract:
Electrostatic chucks, plasma processing apparatuses, and methods of fabricating semiconductor devices using the same are provided. The electrostatic chuck includes a chuck base, an upper plate provided on the chuck base, and an inner plate provided between the chuck base and the upper plate. A first diameter of the inner plate is less than a second diameter of the upper plate.
Information query
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