Invention Application
- Patent Title: SHEET PROCESSING DEVICE AND SHEET PROCESSING METHOD
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Application No.: US16695527Application Date: 2019-11-26
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Publication No.: US20200164668A1Publication Date: 2020-05-28
- Inventor: Tetsuya AOYAMA
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33299101 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33dbef26
- Main IPC: B41J11/70
- IPC: B41J11/70
Abstract:
A sheet processing device includes a liquid ejection unit which adheres a liquid containing a binder which binds fibers together to a predetermined region of a sheet and a cutting portion which cuts out the region to which the liquid is adhered.
Public/Granted literature
- US1643720A Connecting-rod structure Public/Granted day:1927-09-27
Information query
IPC分类:
