Invention Application
- Patent Title: PRESSURE-SENSITIVE ADHESIVE TAPE
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Application No.: US16633837Application Date: 2018-07-24
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Publication No.: US20200165489A1Publication Date: 2020-05-28
- Inventor: Yusuke YAMANARI , Makoto SAITO , Naoaki HIGUCHI , Kenta JOZUKA
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4f14f79a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@475cec31
- International Application: PCT/JP2018/027688 WO 20180724
- Main IPC: C09J7/22
- IPC: C09J7/22 ; C09J131/04 ; C09J133/10 ; C09J133/08 ; C09J7/38
Abstract:
Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.
Public/Granted literature
- US11186750B2 Pressure-sensitive adhesive tape Public/Granted day:2021-11-30
Information query
IPC分类:
