- 专利标题: Substrate Holder and Film Forming Apparatus
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申请号: US16698381申请日: 2019-11-27
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公开(公告)号: US20200165723A1公开(公告)日: 2020-05-28
- 发明人: Toshiaki FUJISATO , Takashi MOCHIZUKI , Daisuke TORIYA , Kouki SUZUKI , Hwajun NOH
- 申请人: TOKYO ELECTRON LIMITED
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1cc6e3a6
- 主分类号: C23C16/458
- IPC分类号: C23C16/458 ; C23C16/50 ; C23C16/455
摘要:
A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.
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