A semiconductor package includes a connection structure, a semiconductor chip, and an encapsulant. The connection structure includes an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer. The semiconductor chip has an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and the active surface is disposed on the connection structure to face the connection structure. The encapsulant covers at least a portion of the semiconductor chip. The semiconductor chip includes a groove formed in the active surface and a dam structure disposed around the groove in the active surface.