Invention Application
- Patent Title: ETCHANT COMPOSITION AND METHODS FOR MANUFACTURING METAL PATTERN AND ARRAY SUBSTRATE USING THE SAME
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Application No.: US16702773Application Date: 2019-12-04
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Publication No.: US20200172807A1Publication Date: 2020-06-04
- Inventor: Bong-Kyun KIM , JinSeuk KIM , SeungBo SHIM , ShinHyuk CHOI , Seung-Hee KIM , Donghee LEE
- Applicant: Samsung Display Co., Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19d88c51
- Main IPC: C09K13/08
- IPC: C09K13/08 ; H01L29/45 ; H01L27/12 ; H01L21/3213

Abstract:
An etchant composition of an embodiment includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound and water, and has a weight ratio of the four-nitrogen ring compound and the two-chlorine compound of about 1:0.5 to about 1:4. The etchant composition may etch a multilayer metal substrate of titanium/copper and may be used for manufacturing a multilayer metal pattern and an array substrate having excellent properties of etched patterns.
Public/Granted literature
- US11441071B2 Etchant composition and methods for manufacturing metal pattern and array substrate using the same Public/Granted day:2022-09-13
Information query