Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MAKE THE SAME
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Application No.: US16779670Application Date: 2020-02-03
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Publication No.: US20200176453A1Publication Date: 2020-06-04
- Inventor: Feng-Yi Chang , Fu-Che Lee , Chieh-Te Chen , Yi-Ching Chang
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4889063c
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
The present invention discloses a semiconductor structure with capacitor landing pad and a method for fabricating a capacitor landing pad. The semiconductor structure with capacitor landing pad includes a substrate having a plurality of contact structures, a first dielectric layer disposed on the substrate and the contact structures, and a plurality of capacitor landing pads, each of the capacitor landing pads being located in the first dielectric layer and electrically connected to the contact structure, wherein the capacitor landing pads presents a shape of a wide top and a narrow bottom and a top surface of the capacitor landing pads have a concave shape.
Information query
IPC分类: