Invention Application
- Patent Title: DEFECT INSPECTION APPARATUS AND PATTERN CHIP
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Application No.: US16628381Application Date: 2017-07-18
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Publication No.: US20200182804A1Publication Date: 2020-06-11
- Inventor: Yuta URANO , Toshifumi HONDA , Akio YAZAKI , Yukihiro SHIBATA , Hideki FUKUSHIMA , Yasuhiro YOSHITAKE
- Applicant: Hitachi High-Technologies Corporation
- International Application: PCT/JP2017/025929 WO 20170718
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G01N21/47

Abstract:
As a technique to improve processing efficiency of defect inspection by quickly adjusting a position of a detection system, provided is a defect inspection apparatus including: a stage that moves with a sample and a pattern substrate placed thereon; an illumination optical system that irradiates an object on the stage from a direction inclined from the normal direction of the pattern substrate; a first detection optical system that detects scattered light in the normal direction; a second detection optical system that detects scattered light in a direction different from the scattered light detected by the first detection optical system; a signal processing unit that processes both scattered light signals; and a control unit. The control unit implements first adjustment processing of adjusting a focal position of the first or the second detection optical system and a three-dimensional position of each detector with respect to an illumination region by using a scattered light signal and second adjustment processing of adjusting a focal point by changing a position in an optical axis direction of a detector of the first or the second detection optical system and a position in a height direction of the stage, and implements the second adjustment processing at a higher frequency than the first adjustment processing.
Public/Granted literature
- US10955361B2 Defect inspection apparatus and pattern chip Public/Granted day:2021-03-23
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