Invention Application
- Patent Title: BULK-ACOUSTIC WAVE RESONATOR
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Application No.: US16411273Application Date: 2019-05-14
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Publication No.: US20200186125A1Publication Date: 2020-06-11
- Inventor: Tae Kyung LEE , Yoon Sok PARK , Dae Hun JEONG
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46d9fc7f
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/02 ; H03H9/205

Abstract:
A bulk-acoustic wave resonator includes: a first substrate formed of a first material; an insulating layer or a piezoelectric layer disposed on a first side of the first substrate; and a second substrate formed of a second material and disposed on a second side of the first substrate, wherein the second material has thermal conductivity that is higher than a thermal conductivity of the first material.
Public/Granted literature
- US11050404B2 Bulk-acoustic wave resonator Public/Granted day:2021-06-29
Information query
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