Invention Application
- Patent Title: ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US16564125Application Date: 2019-09-09
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Publication No.: US20200207790A1Publication Date: 2020-07-02
- Inventor: Gyu-Hee Park , Takanori Koide , Yoshiki Manabe , Masayuki Kimura , Akio Saito , Jaesoon Lim , Younjoung Cho
- Applicant: Samsung Electronics Co., Ltd. , Adeka Corporation
- Applicant Address: KR Suwon-si JP Tokyo
- Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee Address: KR Suwon-si JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19dc343f
- Main IPC: C07F5/06
- IPC: C07F5/06 ; C09D1/00 ; C09D5/00 ; H01L21/02 ; C23C16/20
Abstract:
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
Public/Granted literature
- US11332486B2 Aluminum compound and method for manufacturing semiconductor device using the same Public/Granted day:2022-05-17
Information query
