• Patent Title: HAPTIC ACTUATOR INCLUDING OVERMOLDED FIELD MEMBER AND RELATED METHODS
  • Application No.: US16233867
    Application Date: 2018-12-27
  • Publication No.: US20200209968A1
    Publication Date: 2020-07-02
  • Inventor: Nils E. Larson
  • Applicant: Apple Inc.
  • Main IPC: G06F3/01
  • IPC: G06F3/01 H04M1/02
HAPTIC ACTUATOR INCLUDING OVERMOLDED FIELD MEMBER AND RELATED METHODS
Abstract:
A haptic actuator may include a housing, a coil carried by the housing, and a field member movable within the housing responsive to the coil. The field member may include a frame having opposing first and second ends, at least one magnet carried by the frame, and a first overmolded endcap coupled to the first end of the frame. The field member may also include a second overmolded endcap coupled to the second end of the frame. The haptic actuator may include a first flexure having an inner end coupled to the first overmolded endcap, and an outer end coupled to adjacent portions of the housing. The haptic actuator may also include a second flexure having an inner end coupled to the second overmolded endcap, and an outer end coupled to adjacent portions of the housing.
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