A radiation-emitting semiconductor chip may include a semiconductor body having a first layer, a second layer, and an active layer therebetween. The active layer may be subdivided into a multiplicity of segments in a plan view of the chip. A separating structure may be formed in the semiconductor body between neighboring segments. The multiplicity of segments may be electrically connected to one another in series and/or in parallel. At least one segment may be assigned a first contact layer having a first contact finger structure and a second contact layer having a second contact finger structure. There may be a direct electrical contact between the first contact layer and the second contact layer in places.