A method for mounting a metal substrate to a first substrate comprises a metal substrate having a plurality of through holes in at least a portion of the metal substrate and the application of a one part moisture curing adhesive on the adherend first surface, adherend metal surface or both. The first substrate and metal substrate are contacted interposing the adhesive between the adherend first surface and the adherend metal surface such that a portion of the length of at least one through hole is penetrated by the adhesive. The adhesive is cured in the presence of moisture.