Invention Application
- Patent Title: METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
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Application No.: US16795009Application Date: 2020-02-19
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Publication No.: US20200266078A1Publication Date: 2020-08-20
- Inventor: Yong Sung EOM , KWANG-SEONG CHOI , Ki Seok JANG , Seok-Hwan MOON , Jiho JOO
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@448d040d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@296efb85 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@8ca9397
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/00 ; H01L21/48
Abstract:
Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
Public/Granted literature
- US11488841B2 Method for manufacturing semiconductor package Public/Granted day:2022-11-01
Information query
IPC分类:
