- 专利标题： STACK STRUCTURE OF PRINTED CIRCUIT BOARDS USING INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAME
-
申请号： US16789575申请日： 2020-02-13
-
公开(公告)号： US20200266562A1公开(公告)日： 2020-08-20
- 发明人: Jungsik PARK , Inkuk YUN , Sunghyup LEE , Heeseok JUNG , Woongeun KWAK
- 申请人： Samsung Electronics Co., Ltd.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7ae88801
- 主分类号： H01R12/52
- IPC分类号： H01R12/52 ; H05K1/11 ; H05K5/00
摘要：
An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.