Invention Application
- Patent Title: POLYETHYLENE FORMULATIONS WITH IMPROVED BARRIER AND TOUGHNESS FOR MOLDING APPLICATIONS
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Application No.: US16064267Application Date: 2016-12-15
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Publication No.: US20200277474A1Publication Date: 2020-09-03
- Inventor: Yijian Lin , Mridula Babli Kapur , David T. Gillespie , John L. Sugden , Todd A. Hogan
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2016/066784 WO 20161215
- Main IPC: C08L23/06
- IPC: C08L23/06 ; C08K5/00 ; B29C49/00

Abstract:
Polyethylene formulations, articles produced therefrom, and methods of making articles are provided. The polyethylene formulation includes a multimodal high density polyethylene (HDPE) composition, and 1 ppm to 10,000 ppm of a nucleating agent, wherein the multimodal HDPE composition comprises a density of 0.940 g/cm3 to 0.970 g/cm3 when measured according to ASTM D792, and a melt index (I2) of 0.01 g/10 min. to 1.0 g/10 min. when measured according to ASTM D1238 at 190° C. and a 2.16 kg load, and wherein the multimodal HDPE composition comprises an infrared cumulative detector fraction (CDFIR) of greater than 0.27 and an infrared cumulative detector fraction to light scattering cumulative detector fraction ratio (CDFIR/CDFLS) from 0.7 to 2.0.
Public/Granted literature
- US11046841B2 Polyethylene formulations with improved barrier and toughness for molding applications Public/Granted day:2021-06-29
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