- 专利标题: LED PACKAGE USING ELECTROFORM STENCIL PRINTING
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申请号: US16901044申请日: 2020-06-15
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公开(公告)号: US20200313060A1公开(公告)日: 2020-10-01
- 发明人: Sridevi A. Vakkalanka , S. Rao Feddada
- 申请人: Lumileds LLC
- 申请人地址: US CA San Jose
- 专利权人: Lumileds LLC
- 当前专利权人: Lumileds LLC
- 当前专利权人地址: US CA San Jose
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4bf9d753
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L33/60 ; B23K31/02 ; H01L33/48 ; B23K3/06 ; B23K1/00
摘要:
A light emitting device comprises a reflector cup coupled to a base that defines a cavity. The base comprises a plurality of metal pads exposed on a bottom surface of the cavity. The base further comprises a plurality of protrusions arranged around a perimeter of the base and disposed inside one or more side surfaces of the reflector cup. The light emitting device comprises an LED die disposed over the bottom surface of the cavity. The LED die is coupled to the metal pads with gold-tin solder. The LED die has a footprint that is at most 30% smaller than an area of a top opening of the cavity.
公开/授权文献
- US10916689B2 LED package using electroform stencil printing 公开/授权日:2021-02-09