- 专利标题: RESIN COMPOSITION, MOLDED ARTICLE AND HEAT-EXPANDABLE MICROSPHERES
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申请号: US16954576申请日: 2018-12-14
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公开(公告)号: US20200332085A1公开(公告)日: 2020-10-22
- 发明人: Takumi EBE , Katsushi MIKI
- 申请人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 申请人地址: JP Yao-shi, Osaka
- 专利权人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人地址: JP Yao-shi, Osaka
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3073c34b
- 国际申请: PCT/JP2018/046015 WO 20181214
- 主分类号: C08K9/10
- IPC分类号: C08K9/10 ; C08J3/22 ; C08J9/32 ; C08K5/01 ; C08L23/00 ; B29C44/02 ; B29C44/50
摘要:
A resin composition containing heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and at least one base resin selected from rubbers, olefin resins and thermoplastic elastomers. The thermoplastic resin is a polymer of a polymerizable component containing N-substituted maleimide and a nitrile monomer containing methacrylonitrile. Also disclosed are molded articles manufactured by molding the resin composition.