发明申请
- 专利标题: ELECTRONIC DEVICE COVERS
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申请号: US16959110申请日: 2018-01-05
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公开(公告)号: US20200333841A1公开(公告)日: 2020-10-22
- 发明人: Philip Moon , Ilchan Lee , Stacy L. Wolff
- 申请人: Hewlett-Packard Development Company, L.P.
- 国际申请: PCT/US2018/012526 WO 20180105
- 主分类号: G06F1/16
- IPC分类号: G06F1/16 ; G06F3/02
摘要:
An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
公开/授权文献
- US11493960B2 Electronic device covers 公开/授权日:2022-11-08
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