- 专利标题: ELECTRONIC DEVICE COMPRISING HEAT RADIATING STRUCTURE
-
申请号: US16763074申请日: 2018-08-28
-
公开(公告)号: US20200352057A1公开(公告)日: 2020-11-05
- 发明人: Chung-Hyo JUNG , Kang-Sik KIM , Young-San KIM , Won-Min KIM , Chi-Hyun CHO
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1fc0f0df
- 国际申请: PCT/KR2018/009900 WO 20180828
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L23/552 ; H05K9/00
摘要:
According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
公开/授权文献
- US11445637B2 Electronic device comprising heat radiating structure 公开/授权日:2022-09-13
信息查询