A copper-zinc alloy for producing electrically conductive components, for example contacts, consisting of: 62.5-67% Cu by weight, 0.25-1.0% Sn by weight, 0.015-0.15% Si by weight, at least two silicide-forming elements from the group Mn, Fe, Ni and Al with in each case being at most 0.15% by weight wherein the sum of these elements does not exceed 0.6% by weight, at most 0.1% Pb by weight, the rest being formed by Zn and also unavoidable impurities.