- 专利标题: METHODS OF OVERMOLDING SOFTER MATERIAL WITH HARDER MATERIAL AND MOISTURE TIGHT CONTAINER ASSEMBLIES MADE BY THE METHODS
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申请号: US17038705申请日: 2020-09-30
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公开(公告)号: US20210008771A1公开(公告)日: 2021-01-14
- 发明人: Donald Huber , Jonathan R. Freedman , Brian Tifft , Franklin Lee Lucas, JR.
- 申请人: CSP TECHNOLOGIES, INC.
- 申请人地址: US AL Auburn
- 专利权人: CSP TECHNOLOGIES, INC.
- 当前专利权人: CSP TECHNOLOGIES, INC.
- 当前专利权人地址: US AL Auburn
- 主分类号: B29C45/16
- IPC分类号: B29C45/16 ; B65D43/16 ; B65D53/02 ; B29C45/00
摘要:
A method of over-molding materials includes: providing a first material in a groove in a first portion of a mold such that only a single surface of the first material is exposed to a vacant portion of the mold; providing, via an injection molding process, a second material in a liquid form in the vacant portion of the mold adjacent to, and in engagement with, the first material; and allowing the second material to solidify and become directly coupled to the first material, thus forming a single component. During the method, the entire single surface of the first material is flush with a plane defined by outer surface of the first portion of the mold. The second material has one or both of a greater hardness when solidified than the first material and/or a higher melting temperature than the first material.
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