Invention Application
- Patent Title: HINGE ASSEMBLIES
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Application No.: US16980868Application Date: 2018-03-16
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Publication No.: US20210011526A1Publication Date: 2021-01-14
- Inventor: Wei-Chung Chen , Kuan-Ting Wu
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2018/022931 WO 20180316
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02

Abstract:
Examples of hinge assemblies are described. In an example, a hinge assembly includes a first hinge element having a first shaft, a second hinge element having a second shaft, and a clip coupling the first shaft to the second shaft. The clip includes a first portion formed of c a composite material and a second portion formed of a metal.
Public/Granted literature
- US11379014B2 Hinge assemblies Public/Granted day:2022-07-05
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