Invention Application
- Patent Title: CAMERA MODULE ASSEMBLY INCLUDING FLEXIBLE CIRCUIT BOARD MAINTAINED IN BENT STATE AND ELECTRONIC DEVICE INCLUDING SAME
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Application No.: US16975047Application Date: 2019-02-20
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Publication No.: US20210014392A1Publication Date: 2021-01-14
- Inventor: Myungjae JO , Kwangmin GIL
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Priority: KR10-2018-0021629 20180223
- International Application: PCT/KR2019/002037 WO 20190220
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/02

Abstract:
Various embodiments related to a camera module assembly are presented and, according to one embodiment, the camera module assembly comprises: at least one camera module including a lens assembly, an image sensor configured to receive light having passed through the lens assembly, a camera housing for accommodating the lens assembly and the image sensor therein, a circuit board having the image sensor arranged thereon, and a flexible printed circuit board electrically connected with the circuit board and including wiring and a connector, which are for connecting the image sensor with an external device; and a support member including an opening for accommodating the at least one camera module in at least a part thereof, wherein the support member can be formed such that at least a part of the flexible printed circuit board is maintained in a bent state through at least a part of the opening, and additional other various embodiments are possible.
Public/Granted literature
Information query