- 专利标题： RESIN POWDER FOR SOLID FREEFORM FABRICATION, DEVICE FOR FABRICATING SOLID FREEFORM FABRICATION OBJECT, AND METHOD OF FABRICATING SOLID FREEFORM FABRICATION OBJECT
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申请号： US16936498申请日： 2020-07-23
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公开(公告)号： US20210023778A1公开(公告)日： 2021-01-28
- 发明人: Sohichiroh Iida , Hitoshi Iwatsuki , Satoshi Ogawa , Yunsheng Sun
- 申请人： Sohichiroh Iida , Hitoshi Iwatsuki , Satoshi Ogawa , Yunsheng Sun
- 申请人地址： JP Kanagawa; JP Kanagawa; JP Nara; JP Kanagawa
- 专利权人： Sohichiroh Iida,Hitoshi Iwatsuki,Satoshi Ogawa,Yunsheng Sun
- 当前专利权人： Sohichiroh Iida,Hitoshi Iwatsuki,Satoshi Ogawa,Yunsheng Sun
- 当前专利权人地址： JP Kanagawa; JP Kanagawa; JP Nara; JP Kanagawa
- 优先权： JP2019-138133 20190726
- 主分类号： B29C64/153
- IPC分类号： B29C64/153 ; B33Y10/00 ; B33Y30/00 ; B33Y70/00 ; B29C64/268
摘要：
A resin powder for solid freeform fabrication is provided which maintains the degree of smoothness of a thin layer formed with the resin powder for solid freeform fabrication even when the speed of supplying the resin powder for solid freeform fabrication using a recoater is increased and reduce lowering of the degree of smoothness of the thin layer caused by the resin powder for solid freeform fabrication that has scattered and accumulated on the recoater and others.
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