A thermoelectric device according to an embodiment of the present invention comprises: a first metal support; a first bonding layer disposed on the first metal support; a first resin layer disposed on the first bonding layer; a plurality of first electrodes arranged on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; a second bonding layer disposed on the second resin layer; and a second metal support disposed on the second bonding layer, wherein the thermoelectric device further comprises at least one dummy electrode disposed on the first resin layer, and the at least one dummy electrode is disposed on the side of at least one of the outermost row and the outermost column of the plurality of first electrodes.