Invention Application
- Patent Title: BONDING MATERIAL AND METHOD FOR MANUFACTURING THE SAME AND FIBER MOLDED ARTICLE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US16989938Application Date: 2020-08-11
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Publication No.: US20210047763A1Publication Date: 2021-02-18
- Inventor: Masahiko NAKAZAWA , Yoshihiro UENO
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2019-148464 20190813
- Main IPC: D04H1/60
- IPC: D04H1/60 ; D04H1/587 ; B29B7/82 ; B29B9/16 ; D04H1/425 ; C09J167/00
Abstract:
A bonding material for fiber binding includes a resin composition containing an amorphous thermoplastic resin and a crystalline thermoplastic resin, where the bonding material has a melting temperature lower than the melting temperature of the crystalline thermoplastic resin and a softening temperature higher than the softening temperature of the amorphous thermoplastic resin.
Information query
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