Invention Application
- Patent Title: Device and Method for Spraying Mold-Releasing Agent
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Application No.: US16965961Application Date: 2019-02-19
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Publication No.: US20210069776A1Publication Date: 2021-03-11
- Inventor: Shuji TAKASU , Tokiya TERABE
- Applicant: SINTOKOGIO LTD.
- Applicant Address: JP Aichi
- Assignee: SINTOKOGIO LTD.
- Current Assignee: SINTOKOGIO LTD.
- Current Assignee Address: JP Aichi
- Priority: JP2018-066496 20180330
- International Application: PCT/JP2019/006099 WO 20190219
- Main IPC: B22C23/02
- IPC: B22C23/02

Abstract:
A device for spraying a mold-releasing agent and a method therefor is provided by which a sticker and a defective drawing of a mold are prevented from occurring by detecting a leak of the mold-releasing agent, a clogging of a nozzle for spraying the mold-releasing agent, or a failure of a piece of equipment of the device for spraying the mold-releasing agent, to properly control the volume of the sprayed mold-releasing agent. A device 1 for spraying a mold-releasing agent that sprays a mold-releasing agent A on a pattern plate 20 in a molding machine that forms molds from molding sand S by using a flask 10 and the pattern plate 20, comprising a nozzle 30 for spraying the mold-releasing agent that sprays the mold-releasing agent A on the pattern plate 20, a piping 40 for supplying the mold-releasing agent that supplies the mold-releasing agent A to the nozzle 30 for spraying the mold-releasing agent, a flow sensor 42 that measures a flow rate of the mold-releasing agent A that flows in the piping 40 for supplying the mold-releasing agent, and a controller 90 that detects a leak of the mold-releasing agent A, a clogging of the nozzle 30 for spraying the mold-releasing agent, or a failure of a piece of equipment of the device 1 for spraying the mold-releasing agent, based on the measured flow rate.
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