- 专利标题： INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING
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申请号： US17119737申请日： 2020-12-11
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公开(公告)号： US20210094070A1公开(公告)日： 2021-04-01
- 发明人: Brian BIRCUMSHAW , Sandeep AKKARAJU
- 申请人： eXo Imaging, Inc.
- 申请人地址： US CA Redwood City
- 专利权人： eXo Imaging, Inc.
- 当前专利权人： eXo Imaging, Inc.
- 当前专利权人地址： US CA Redwood City
- 主分类号： B06B1/06
- IPC分类号： B06B1/06 ; H01L41/04 ; H01L41/338 ; G01S7/52 ; H01L41/187 ; G01S15/89 ; H01L41/047 ; H01L41/313
摘要：
The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.