Thermocouples for high temperature applications are provided. A thermocouple includes a vessel formed from a dielectric material, the vessel defining a first chamber and a second chamber, the first chamber and second chamber in fluid communication. The thermocouple further includes a first thermoelement disposed in the first chamber, the first thermoelement formed from a first thermoelectric material. The thermocouple further includes a second thermoelement disposed in the second chamber, the second thermoelement formed from a second thermoelectric material different from the first thermoelectric material, and wherein the second thermoelement is a liquid at operating conditions of the thermocouple.