Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Application No.: US16667615Application Date: 2019-10-29
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Publication No.: US20210126135A1Publication Date: 2021-04-29
- Inventor: Wei-Ju LEE , Chun-Fu CHENG , Chung-Wei WU , Zhiqiang WU
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/423 ; H01L29/417 ; H01L29/10 ; H01L29/06

Abstract:
A semiconductor device includes a substrate, a plurality of nanowires, a gate structure, a source/drain epitaxy structure, and a semiconductor layer. The substrate has a protrusion portion. The nanowires extend in a first direction above the protrusion portion of the substrate, the nanowires being arranged in a second direction substantially perpendicular to the first direction. The gate structure wraps around each of the nanowires. The source/drain epitaxy structure is in contact with an end surface of each of the nanowires, in which a bottom surface of the source/drain epitaxy structure is lower than a top surface of the protrusion portion of the substrate. The semiconductor layer is in contact with the bottom surface of the epitaxy structure, in which the semiconductor layer is spaced from the protrusion portion of the substrate.
Public/Granted literature
- US11469332B2 Semiconductor device and manufacturing method thereof Public/Granted day:2022-10-11
Information query
IPC分类: