发明申请
- 专利标题： CAMERA MODULE CAPABLE OF DISSIPATING HEAT AND ELECTRONIC DEVICE USING THE SAME
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申请号： US16727740申请日： 2019-12-26
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公开(公告)号： US20210127477A1公开(公告)日： 2021-04-29
- 发明人: KUN LI , SHIN-WEN CHEN , LONG-FEI ZHANG , XIAO-MEI MA
- 申请人： TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- 申请人地址： CN Shenzhen
- 专利权人： TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- 当前专利权人： TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- 当前专利权人地址： CN Shenzhen
- 优先权： CN201911033357.9 20191028
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; G02B7/04 ; G02B7/02 ; H05K1/18 ; H04N5/225
摘要：
A camera module includes a printed circuit board, a sensor, and a refrigeration chip. A first receiving groove is defined in the printed circuit board. The sensor is received in the first receiving groove and electrically connected to the printed circuit board. The refrigeration chip is formed on and electrically connected to the printed circuit board. The refrigeration chip comprises a cold surface. The sensor is formed on the cold surface. The cold surface is configured to absorb heat from the sensor when the refrigeration chip is powered on. The camera module is capable of dissipating heat and controlling an internal temperature of the camera module.
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